The big PlayStation 5 will have a refined cooling system under its hood.

The following four images are from Sony’s patent below.

It was filed last year by Sony, revealing that they would use liquid cooling technology to overcome the limitations of thermal paste. The cooling system will use metal alloys, such as silver and copper as well that will help the console not overheat. The liquid metal would be applied to the heat sink, and the fans and airflow would carry the heat out of the system.

„When the heat generation amount of the semiconductor chip increases, it becomes difficult to sufficiently cool the semiconductor chip due to the thermal resistance possessed by the grease. In the semiconductor device…a metal liquefied by heat at the time of operation of a semiconductor chip is used as a heat conductive material between the semiconductor chip and the radiator in place of grease. When such a metal is used, the thermal resistance between the semiconductor chip and the radiator is lowered, and the cooling performance of the semiconductor chip can be improved.

In a structure using a metal having fluidity as a heat conductive material, to sufficiently exhibit cooling performance, it is important to limit a range in which the heat conductive material spreads even when a posture change or vibration of the semiconductor device occurs. Furthermore, when the heat sink is pressed against the semiconductor chip, the force must act sufficiently on the semiconductor chip. That is, adhesion between the semiconductor chip and the radiator is also important,” the overview of the patent says.

Even if it’s not confirmed yet, the timing looks suspicious, so the PlayStation 5 Standard Edition and the PlayStation 5 Digital Edition (the latter omits a Blu-ray drive) might use this technique after all. The console will launch in November, as the Xbox Series X has been confirmed to be available from that month.

Source: DualShockers

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