TECH NEWS – They will spend some time in Taiwan to gain the necessary experience for manufacturing in the US.

Taiwan is the center of advanced chip manufacturing. TSMC’s two factories there are reportedly fully booked as the manufacturer aims to reach monthly production of 100,000 wafers by the end of 2026. Since the region is at the forefront of next-generation lithography, the US factory in Arizona, which employs hundreds of engineers, cannot move forward without further training. These specialists are being sent abroad to learn 3- and 2-nm manufacturing techniques, which will give the Arizona factory a significant advantage in winning chip orders later on.

Currently, the factory is focusing on 5- and 4-nm manufacturing and will switch to more advanced lithography once its engineers have gained experience. Several employees are traveling to Taiwan to learn more about 3- and 2-nm technologies. Construction has begun on TSMC’s second Arizona factory, so the trip to Taiwan could not have come at a better time. The facility is not expected to begin 3-nm production until the third quarter of 2027, and trial runs of the 2-nm and A16 processes are expected in 2028. Demand for 3-nm and 2-nm silicon wafers has skyrocketed. JPMorgan analysts say 3-nm capacity could reach its limit by 2026, so TSMC is reportedly planning to build three additional 2-nm factories at its headquarters. The initial investment is expected to reach $28.6 billion.

TSMC is also rushing to bring its advanced packaging technology to the United States, expected in 2027. Apple, TSMC’s most profitable customer for years, has reportedly secured more than half of the initial 2nm batch for its A20 and A20 Pro models. Nvidia, on the other hand, will reportedly use only the A16 node for its upcoming GPUs.

Advanced chip manufacturing in the US is thus taking serious steps toward becoming a reality.

Source: WCCFTech