PlayStation 5: Has Sony Fixed the Liquid Metal Problem in the Base Model Too?

Sony has finally solved the liquid metal problem, and not just for the PlayStation 5 Pro. The latest PlayStation 5 model features an updated, quieter liquid metal thermal interface material (TIM), which reduces spillage and leakage while providing better cooling. Although liquid metal provides better cooling performance for the system on a chip (SoC), it is much more difficult to handle during disassembly and is prone to spillage. To prevent leakage, a spacer has been added to the interposer next to the SoC (APU). Despite this, many PlayStation 5 owners still experience problems with liquid metal thermal interface material (TIM). The models primarily affected were the standard PlayStation 5 and the “Slim” PlayStation 5 (CFI-2016). Sony solved this issue with the PlayStation 5 Pro by adding deeper grooves and a slightly different liquid metal TIM layout for the main SoC. This design protects against leaks and spills, proving to be an effective and simple solution.

 

It appears that the same liquid metal TIM application will be used for the base model as well. According to Modyfikator89 on Twitter, the latest CFI-2100/2200 models of the PlayStation 5 have received this update. This can be confirmed by engraved lines in the liquid metal TIM area. If the surface is smooth, then the PlayStation 5 is based on an older model that did not receive the update. If you have an older model and aren’t experiencing serious problems, such as overheating when properly ventilated and cleaned, there’s no need to worry. However, if you are experiencing these issues, you can ask a professional or console service to reapply the liquid metal TIM, as it is difficult and complicated.

If you want the latest revision, look for the CFI-2116 B01Y model when buying a new PlayStation 5.

Source: WCCFTech

Older PlayStation 5 cooling design
New PlayStation 5 revision with improved liquid metal layout

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